Test apparatus which tests semiconductor chips
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United States of America Patent
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Mar 23, 2021
Grant Date -
Feb 1, 2018
app pub date -
Mar 2, 2017
filing date -
Jul 27, 2016
priority date (Note) -
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Abstract
A test apparatus includes a motherboard including a first surface. The test apparatus further includes a handler including a second surface facing the first surface of the motherboard. The test apparatus additionally includes an adapter board disposed between the first surface of the motherboard and the second surface of the handler. The test apparatus further includes a first sensor mounted on the adapter board and senses data about temperature of the adapter board. The test apparatus additionally includes a wireless transceiver mounted on the adapter board and transmits, in real time, the sensed data.
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