Test board for semiconductor package, test system, and method of manufacturing semiconductor package
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United States of America Patent
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Oct 2, 2018
Grant Date -
Feb 1, 2018
app pub date -
Mar 10, 2017
filing date -
Jul 27, 2016
priority date (Note) -
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Abstract
A test board includes: a board substrate; a device under test (DUT) socket connected to the board substrate and configured to accommodate a semiconductor package; a test controller; a wireless signal unit configured to wirelessly exchange signals with a server; and a wireless power unit configured to be wirelessly charged by an external source and configured to supply electric power to the test controller and the DUT socket, wherein the test controller is configured to independently perform a test on the semiconductor package accommodated in the DUT socket in response to a test pattern command being wirelessly received from the server via the wireless signal unit.
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