Device for integrated current measurement inside a high-voltage contact of a hybrid module
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United States of America Patent
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Jul 14, 2020
Grant Date -
Feb 1, 2018
app pub date -
Feb 10, 2016
filing date -
Feb 16, 2015
priority date (Note) -
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Abstract
A device for integrated current measurement inside a high-voltage contact-making means of a hybrid module includes a printed circuit board with at least one current sensor chip that is arranged on the printed circuit board. The device further includes a high-voltage contact-making plug connection, which is mounted on the printed circuit board. The high-voltage contact-making plug connection has at least one Hall ring and one busbar that is passed through the Hall ring, wherein the Hall ring has an open cross section and the sensor chip is at least partially accommodated in the open cross section.
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