System and method for measurement of semiconductor device fabrication tool implement

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United States of America Patent

PATENT NO 10276455
APP PUB NO 20180031492A1
SERIAL NO

15224191

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Abstract

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Methods, and corresponding systems, are described that include providing a laser-based measurement tool. An implement of a semiconductor fabrication process tool (e.g., susceptor) is delivered to the laser-based measurement tool where a plurality of measurements is performed of a surface of the implement using a blue wavelength radiation. The measurements are of a distance (e.g., angstroms) from a reference plane and provide an indication of the profile of the surface of the susceptor. As the surface profile of the susceptor can affect layers deposited on target substrates using the susceptor, the measurements provide for a disposition of the susceptor.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hung, Shih-Wei Kaohsiung, TW 59 217
Lin, Chien-Feng Hsinchu County, TW 34 164
Lu, Charng-Long Yunlin County, TW 2 0

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