HEAT DISSIPATING DEVICE
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United States of America Patent
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Issued Date -
Feb 1, 2018
app pub date -
Jul 26, 2016
filing date -
Jul 26, 2016
priority date (Note) -
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Abstract
A heat dissipating device applied to a heat generating element includes a cooling device, a vapor chamber and a heat pipe, and the vapor chamber is attached to the heat generating element, and the heat pipe is thermally coupled to the cooling device and communicated with the vapor chamber, and the heat pipe has at least one flexible portion. The heat pipe may be bent or deformed at any angle or in any direction through the flexible portion, so that the heat pipe can be installed and aligned and the height difference can be adjusted with respect to the cooling device, the vapor chamber and the heat generating element in a better way. In the meantime, the heat dissipating device has a shock absorbing capability.
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