PLATING HAVING INCREASED THICKNESS AND REDUCED GRAIN SIZE

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United States of America Patent

SERIAL NO

15661368

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Abstract

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Contacts that may be highly corrosion resistant, less susceptible to wear, and may be readily manufactured with a process that controls or reduces resource usage. Corrosion resistance and wear performance may be improved by providing a thicker plating that has a reduced tendency to crack and by using materials that act as catalysts. Wear performance may be improved by reducing grain size for a harder plating. An amount of resources needed may be reduced or controlled by using materials that plate well and by using a manufacturing process having a reduced number of steps.

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Patent Owner(s)

Patent OwnerAddress
APPLE INCONE APPLE PARK WAY CUPERTINO CA 95014

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Esmaeili, Hani Santa Clara, US 22 175
Kwok, Raymund W M Hong Kong, HK 12 55
Wagman, Daniel C Scotts Valley, US 48 1103
Wright, James A Los Gatos, US 63 1078

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