COMPOUND, RESIN, MATERIAL FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, COMPOSITION FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, RESIST PATTERN FORMING METHOD, CIRCUIT PATTERN FORMING METHOD, AND PURIFICATION METHOD OF COMPOUND OR RESIN

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United States of America Patent

APP PUB NO 20180029968A1
SERIAL NO

15550207

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A compound represented by the following formula (1).

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI GAS CHEMICAL COMPANY INC5-2 MARUNOUCHI 2-CHOME CHIYODA-KU TOKYO 1008324

International Classification(s)

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  • 2016 Application Filing Year
  • C08G Class
  • 2968 Applications Filed
  • 2200 Patents Issued To-Date
  • 74.13 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances20162017201820192020202120222023202420250255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
ECHIGO, Masatoshi Tokyo, JP 137 625
MAKINOSHIMA, Takashi Kanagawa, JP 57 168
SATO, Takashi Kanagawa, JP 973 9680
TOIDA, Takumi Kanagawa, JP 22 64

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Patent Citation Ranking

  • 5 Citation Count
  • C08G Class
  • 39.35 % this patent is cited more than
  • 7 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges44763146731101 - 1011 - 2021 - 3031 - 4041 - 5061 - 70050100150200250300350400450500550600650700

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