Apparatuses and methods for laser processing

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United States of America Patent

PATENT NO 10377658
APP PUB NO 20180029919A1
SERIAL NO

15657320

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A workpiece may be laser processed by a method that may include forming a contour line in the workpiece, and directing an infrared laser beam onto the workpiece along or near the contour line to separate the workpiece along the contour line. The contour line may include defects in the workpiece. The infrared laser beam may have a beam profile such that a greater distribution of cumulated energy from the infrared laser beam is located in areas adjacent to the contour line than directly on the contour line.

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Patent Owner(s)

Patent OwnerAddress
CORNING INCORPORATEDONE RIVERFRONT PLAZA CORNING NY 14831

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Schillinger, Helmut München, DE 16 587
Schnitzler, Daniel Bedburg, DE 2 47

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