Element substrate, printhead, and printing apparatus
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Apr 9, 2019
Grant Date -
Feb 1, 2018
app pub date -
Jul 5, 2017
filing date -
Jul 29, 2016
priority date (Note) -
In Force
status (Latency Note)
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Importance

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Abstract
An element substrate comprises: a plurality of heat elements which include a first heat element and a second heat element configured to supply heat to a liquid for printing; and a plurality of driving circuits which include a first driving circuit configured to drive the first heat element and a second driving circuit configured to drive the second heat element, wherein the plurality of heat elements and the plurality of driving circuits are stacked and arranged on the element substrate, and the first heat element is arranged so as to overlap at least a part of the second driving circuit when viewed from a direction perpendicular to the element substrate.
First Claim
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Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
CANON KABUSHIKI KAISHA | TOKYO JAPAN DAEJEON 3 MEATBALLS 30 2 TOKYO TOKYO METROPOLIS |
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Kasai, Ryo | Tokyo, JP | 87 | 359 |
# of filed Patents : 87 Total Citations : 359 |
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- B41J Class
- 0 % this patent is cited more than
- 6 Age
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7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Oct 9, 2026 |
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