Element substrate, printhead, and printing apparatus

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United States of America Patent

PATENT NO 10252523
APP PUB NO 20180029357A1
SERIAL NO

15641647

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An element substrate comprises: a plurality of heat elements which include a first heat element and a second heat element configured to supply heat to a liquid for printing; and a plurality of driving circuits which include a first driving circuit configured to drive the first heat element and a second driving circuit configured to drive the second heat element, wherein the plurality of heat elements and the plurality of driving circuits are stacked and arranged on the element substrate, and the first heat element is arranged so as to overlap at least a part of the second driving circuit when viewed from a direction perpendicular to the element substrate.

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Patent Owner(s)

Patent OwnerAddress
CANON KABUSHIKI KAISHATOKYO JAPAN DAEJEON 3 MEATBALLS 30 2 TOKYO TOKYO METROPOLIS

International Classification(s)

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Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances2017201820192020202120222023202420250255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kasai, Ryo Tokyo, JP 87 359

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  • B41J Class
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Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges14161870962331101 - 1011 - 2021 - 3031 - 4051 - 60100 +010020030040050060070080090010001100120013001400150016001700180019002000

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