Hybrid lead-free solder wire

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United States of America Patent

PATENT NO 10328533
APP PUB NO 20180029170A1
SERIAL NO

15725265

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Abstract

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A braided solder wire rope includes a first alloy including Bi—Ag, Bi—Cu, Bi—Ag—Cu, or Bi—Sb; and the second alloy including Sn, In Sn—Ag, Sn—Cu, Sn—Ag—Cu, Sn—Zn, Bi—Sn, Sn—In, Sn—Sb or Bi—In, such that the second alloy controls an interface reaction chemistry with various metallization surface finish materials without interfering with a high temperature performance of the first alloy. The first alloy may have a solidus temperature around 258° C. and at least the first alloy of the first wire and the second alloy of the second wire may be braided together.

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Patent Owner(s)

Patent OwnerAddress
INDIUM CORPORATION34 ROBINSON ROAD CLINTON NY 20876

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lee, Ning-Cheng New Hartford, US 46 254
Zhang, Hongwen New Hartford, US 18 354

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