Lead-free solder alloy, solder joint, solder paste composition, electronic circuit board, and electronic device

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United States of America Patent

PATENT NO 10926360
APP PUB NO 20180029169A1
SERIAL NO

15709424

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Abstract

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According to one aspect of the present invention, a lead-free solder alloy includes 2% by mass or more and 3.1% by mass or less of Ag, more than 0% by mass and 1% by mass or less of Cu, 1% by mass or more and 5% by mass or less of Sb, 3.1% by mass or more and 4.5% by mass or less of Bi, 0.01% by mass or more and 0.25% by mass or less of Ni, and Sn.

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Patent Owner(s)

Patent OwnerAddress
TAMURA CORPORATION1-19-43 HIGASHI-OIZUMI NERIMA-KU TOKYO 1788511

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Arai, Masaya Iruma, JP 34 485
Hori, Atsushi Iruma, JP 80 570
Katsuyama, Tsukasa Iruma, JP 5 27
Maruyama, Daisuke Iruma, JP 72 521
Munekawa, Yurika Iruma, JP 5 9
Nakano, Takeshi Iruma, JP 103 671

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