COPPER-CONTAINING PARTICLES, CONDUCTOR-FORMING COMPOSITION, METHOD OF PRODUCING CONDUCTIOR, CONDUCTOR, AND APPARATUS

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United States of America Patent

SERIAL NO

15552981

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Abstract

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Copper-containing particles each include: a core particle containing copper; and an organic substance on at least a part of the surface of the core particle, in which a proportion of copper-containing particles having a major-axis length of 50 nm or less is 55% by number or less with respect to the total number of the copper-containing particles.

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Patent Owner(s)

Patent OwnerAddress
HITACHI CHEMICAL COMPANY LTDCHIYODA-KU TOKYO 100-6606

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
KUMASHIRO, Yasushi Chiyoda-ku, Tokyo, JP 21 243
URASHIMA, Kohsuke Chiyoda-ku, Tokyo, JP 3 10
YONEKURA, Motoki Chiyoda-ku, Tokyo, JP 7 3

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