REARWARD ACOUSTIC DIFFUSION FOR ULTRASOUND-ON-A-CHIP TRANSDUCER ARRAY

Number of patents in Portfolio can not be more than 2000

United States of America Patent

SERIAL NO

15223550

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A heat sink device has a non-planar mounting surface and an ultrasonic transducer substrate attached to the non-planar mounting surface. The non-planar mounting surface of the heat sink device is configured to diffuse acoustic waves that are incident thereupon.

First Claim

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Patent Owner(s)

Patent OwnerAddress
BFLY OPERATIONS INC530 OLD WHITFIELD STREET GUILFORD CT 06437

International Classification(s)

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  • 2016 Application Filing Year
  • H04R Class
  • 3095 Applications Filed
  • 2506 Patents Issued To-Date
  • 80.97 % Issued To-Date

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hageman, Matthew R Hoffman Estates, US 5 22
McNulty, Christopher Thomas Guilford, US 80 3191

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Patent Citation Ranking

  • 18 Citation Count
  • H04R Class
  • 95.53 % this patent is cited more than
  • 7 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges29970535433201 - 1011 - 2021 - 3031 - 4041 - 5051 - 60050100150200250300350400450500550600650700750

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