Flexible circuit board, COF module and electronic device comprising the same
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United States of America Patent
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Jun 11, 2019
Grant Date -
Jan 25, 2018
app pub date -
Jul 24, 2017
filing date -
Jul 22, 2016
priority date (Note) -
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Abstract
A flexible circuit board and an electronic device including a flexible circuit board are provided. The flexible circuit board may include a substrate having a bending area and a non-bending area, a wiring pattern layer provided on the bending area and the non-bending area, a plating layer provided on the wiring pattern layer and including an open area in an area corresponding to the bending area, and a protective layer that directly contacts one surface of the wiring pattern layer exposed at the open area and a side surface of the plating layer. The protective layer may have a larger thickness than a thickness of the plating layer.
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