SUBSTRATE UNIT
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United States of America Patent
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Issued Date -
Jan 25, 2018
app pub date -
Jan 29, 2016
filing date -
Feb 19, 2015
priority date (Note) -
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Abstract
Provided is a substrate unit that has an excellent heat dissipation capability. A substrate unit includes: a substrate having a conductive pattern formed on one surface thereof, the substrate being provided with an opening; a conductive member that includes a main portion that is fixed to the other surface of the substrate, and to which at least one terminal of an electronic component is electrically connected via the opening that is formed in the substrate; and a heat dissipation member with which an extension portion that extends from the main portion of the conductive member is in contact.
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