FOLDED STACKED PACKAGE WITH EMBEDDED DIE MODULE
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
N/A
app pub date -
Jul 19, 2016
filing date -
Jul 19, 2016
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
Described herein are an electronic device and method for constructing same in which a rolled stacked electronic package includes one or more surface mounted embedded die modules. When the package is folded, the embedded die module and another surface mounted module are in contact with one another. The package increases circuit density and reduces microelectronic circuit size.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully