Method for compensating effects of substrate stresses in semiconductor devices, and corresponding device
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United States of America Patent
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Apr 2, 2019
Grant Date -
Jan 25, 2018
app pub date -
Feb 21, 2017
filing date -
Jul 22, 2016
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Abstract
A semiconductor substrate includes a first portion and a second portion. The first portion of the substrate has a first deformation-stress sensor capable of supplying a first stress signal. The second portion of the substrate has a second deformation-stress sensor capable of supplying a second stress signal. The first stress signal and second stress signal are processed by a circuit to produce a compensation signal. The compensation signal is applied in feedback to one of the first and second stress signals to compensate for variations induced in said one of the first and second stress signals by stresses in the semiconductor substrate.
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