Structure and wiring substrate
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Mar 12, 2019
Grant Date -
Jan 25, 2018
app pub date -
Jan 5, 2016
filing date -
Feb 12, 2015
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Provided is a structure including at least: a first conductor plane; a second conductor plane disposed so as to face the first conductor plane; a first transmission line that is formed in a layer different from the first conductor plane and the second conductor plane and is disposed so as to face the second conductor plane, one end of the first transmission line being an open end; a conductor via that connects another end of the first transmission line with the first conductor plane; a slit that is formed on the second conductor plane and stretches to both sides of the first transmission line from a starting point where the slit overlaps the first transmission line in a plan view. Thus, a structure that enables formation of a compact EBG structure is provided.
First Claim
Other Claims data not available
Family
International Classification(s)
- 2016 Application Filing Year
- H01P Class
- 694 Applications Filed
- 597 Patents Issued To-Date
- 86.03 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- H01P Class
- 0 % this patent is cited more than
- 6 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Sep 12, 2026 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Sep 12, 2030 |
