Structure and wiring substrate
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United States of America Patent
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Mar 12, 2019
Grant Date -
Jan 25, 2018
app pub date -
Jan 5, 2016
filing date -
Feb 12, 2015
priority date (Note) -
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Abstract
Provided is a structure including at least: a first conductor plane; a second conductor plane disposed so as to face the first conductor plane; a first transmission line that is formed in a layer different from the first conductor plane and the second conductor plane and is disposed so as to face the second conductor plane, one end of the first transmission line being an open end; a conductor via that connects another end of the first transmission line with the first conductor plane; a slit that is formed on the second conductor plane and stretches to both sides of the first transmission line from a starting point where the slit overlaps the first transmission line in a plan view. Thus, a structure that enables formation of a compact EBG structure is provided.
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