Assembly of electronic components
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United States of America Patent
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Oct 6, 2020
Grant Date -
Jan 25, 2018
app pub date -
Feb 23, 2017
filing date -
Jul 21, 2016
priority date (Note) -
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Abstract
Identical planar electronic components are stacked in an assembly. Each component has two contact metallizations positioned on edges of a same surface of the component. The components are stacked along a common axis. Each successive component is rotated about the common axis by a fixed angle. A value of the fixed angle is selected to position, side by side, the contact metallization of one component and the contact metallization of another next component adjacent to each other in the stack. Electrical connections are provided between two adjacent contact metallizations.
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