THIN-FILM PACKAGE FOR ORGANIC LIGHT-EMITTING DIODE, ORGANIC LIGHT-EMITTING DIODE, AND ORGANIC LIGHT-EMITTING DISPLAY

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United States of America Patent

SERIAL NO

15455287

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Abstract

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The present invention relates to a thin-film package for an organic light-emitting diode, an organic light-emitting diode using the thin-film package, and an organic light-emitting display. The thin-film package includes at least one inorganic film layer and at least one organic film layer, the inorganic film layer and the organic film layer being alternately stacked; the inorganic film layer is made of a material selected from any one of poly(silicon nitride), poly(silicon oxide), poly(silicon carbonitride), poly(silicon carbooxide), poly(silicon carbonitride) and poly(silicon carbonitrideoxide), or any combination thereof; and the organic film layer is made of a material selected from any one of acrolein-based polymer, silicon-based polymer and epoxy-based polymer, or any combination thereof. Compared with a traditional thin-film package structure, the thin-film package according to the present invention achieves a better water and oxygen resistant effect, suffers from a lower stress, and is thus suitable for use in a flexible OLED.

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Patent Owner(s)

Patent OwnerAddress
EVERDISPLAY OPTRONICS (SHANGHAI) LIMITEDNO 1568 JIUGONG ROAD JINSHAN DISTRICT SHANGHAI 201506

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
XIAO, Ling Shanghai, CN 14 21

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