Semiconductor device having protection film with recess

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9947752
APP PUB NO 20180026109A1
SERIAL NO

15601180

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Abstract

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A semiconductor device may include a semiconductor substrate, a first metal film covering a surface of the semiconductor substrate; a protection film covering a peripheral portion of a surface of the first metal film; and a second metal film covering a range extending across a center portion of the surface of the first metal film and a surface of the protection film, wherein a recess may be provided in the surface of the protection film, and a part of the second metal film may be in contact with an inner surface of the recess.

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Patent Owner(s)

Patent OwnerAddress
DENSO CORPORATION1-1 SHOWA-CHO KARIYA-CITY AICHI-PREF 448-8661

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Soeno, Akitaka Toyota, JP 44 619

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