Semiconductor wafers with reduced bow and warpage
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United States of America Patent
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Aug 21, 2018
Grant Date -
Jan 25, 2018
app pub date -
Jul 22, 2016
filing date -
Jul 22, 2016
priority date (Note) -
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Abstract
The present disclosure relates to semiconductor structures and, more particularly, to semiconductor wafers with reduced bowing and warping and methods of manufacture. The structure includes a substrate including plurality of trenches which have progressively different depths as they extend radially inwardly from an edge of the substrate towards a center of the substrate.
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