Image sensor device and method of forming same
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United States of America Patent
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May 14, 2019
Grant Date -
Jan 25, 2018
app pub date -
Sep 25, 2017
filing date -
Feb 24, 2009
priority date (Note) -
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Abstract
An image sensor device includes a first substrate, an interconnect structure, a conductive layer, a conductive via and a second substrate. The first substrate includes a first region including a pixel array and a second region including a circuit. The interconnect structure is over the pixel array or the circuit. The interconnect structure electrically connecting the circuit to the pixel array. The conductive layer is on the interconnect structure. The conductive via passes through the second substrate and at least partially embedded in the conductive layer. The second substrate is over the conductive layer.
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