Semiconductor device and manufacturing method, and electronic appliance
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United States of America Patent
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Feb 5, 2019
Grant Date -
Jan 25, 2018
app pub date -
Feb 22, 2016
filing date -
Mar 5, 2015
priority date (Note) -
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Abstract
There is provided a semiconductor device including: a plurality of bumps (13) on a first semiconductor substrate (11); and a lens material (57) in a region other than the plurality of bumps on the first semiconductor substrate, wherein a distance between a side of a bump closest to the lens material and a side of the lens material closest to the bump is greater than twice a diameter of the bump closest to the lens material, and wherein the distance between the side of the bump closest to the lens material and the side of the lens material closest to the bump is greater a minimum pitch of the bumps.
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