Solid state drive package
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United States of America Patent
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Oct 23, 2018
Grant Date -
Jan 25, 2018
app pub date -
Jul 18, 2017
filing date -
Jul 21, 2016
priority date (Note) -
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status (Latency Note)
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Abstract
A solid state drive package is provided. The solid state drive package may include an integrated circuit substrate including: a lower redistribution layer; a first chip and a second chip provided on the lower redistribution layer; and a connection substrate provided on the lower redistribution layer, the connection substrate provided on an outer periphery of the first chip and the second chip; and a plurality of third chips provided on the integrated circuit substrate. The plurality of third chips are electrically connected to the first chip and the second chip via the connection substrate and the lower redistribution layer.
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