Semiconductor device
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
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May 15, 2018
Issued Date -
N/A
app pub date -
May 16, 2016
filing date -
Jun 18, 2015
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A semiconductor device includes: a first element formed of a first constituent as a main constituent; a second element formed of a second constituent as a main constituent; a heat sink on which the first element and the second element are disposed; a first connection layer electrically connecting the first element to the heat sink; a second connection layer electrically connecting the second element to the heat sink; and a mold resin covering and protecting the first element, the second element and the heat sink. Sizes of the first element and the second element are set so that an equivalent plastic strain increment of the first connection layer is greater than the second connection layer. Accordingly, in the semiconductor device including semiconductor elements formed of different constituents, the elements are thermally protected without providing a temperature detector to the semiconductor element formed of one of the constituents.
First Claim
Other Claims data not available
Family
| Country | kind | publication No. | Filing Date |
|---|---|---|---|
| JP | B2 | JP6384406 | Jun 18, 2015 |
| CN | B | CN107534035 | May 16, 2016 |
| WO | A1 | WO2016203705 | May 16, 2016 |
International Classification(s)
- 2016 Application Filing Year
- H01L Class
- 27971 Applications Filed
- 23507 Patents Issued To-Date
- 84.05 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- H01L Class
- 0 % this patent is cited more than
- 7 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Nov 15, 2025 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Nov 15, 2029 |
