Info package with integrated antennas or inductors

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10269732
APP PUB NO 20180025999A1
SERIAL NO

15283604

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Abstract

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In some embodiments, a semiconductor package includes a die surrounded by a molding material, a redistribution layer over the die and the molding material, the redistribution layer electrically coupled to the die, and a first conductive structure in the molding material and electrically coupled to the die, the first conductive structure being an inductor or an antenna.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Wang, Chuei-Tang Taichung, TW 274 2033
Yu, Chen-Hua Hsin-Chu, TW 2207 47923

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