Reducing wafer warpage during wafer processing
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United States of America Patent
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Jul 17, 2018
Grant Date -
Jan 25, 2018
app pub date -
Oct 2, 2017
filing date -
Mar 12, 2015
priority date (Note) -
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status (Latency Note)
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Abstract
According to one embodiment, there is provided a manufacturing method of a semiconductor device. The method includes forming a first guard ring around a first chip region on a semiconductor wafer. The method includes forming a second guard ring around a second chip region on the semiconductor wafer. The method includes mechanically connecting the first guard ring with the second guard ring through a joist structure.
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