Integrated fan-out package
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United States of America Patent
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Apr 30, 2019
Grant Date -
Jan 25, 2018
app pub date -
Jul 21, 2016
filing date -
Jul 21, 2016
priority date (Note) -
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status (Latency Note)
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Abstract
A semiconductor device including an integrated circuit, a protection layer, and a conductive via is provided. The integrated circuit includes at least one conductive pad. The protection layer covers the integrated circuit. The protection layer includes a contact opening, and the conductive pad is exposed by the contact opening of the protection layer. The conductive via is embedded in the contact opening of the protection layer, and the conductive via is electrically connected to the conductive pad through the contact opening. A method of fabricating the above-mentioned semiconductor device and an integrated fan-out package including the above-mentioned semiconductor device are also provided.
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