Chip

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United States of America Patent

PATENT NO 10475741
APP PUB NO 20180025973A1
SERIAL NO

15715654

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Abstract

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The present embodiments provides a chip, including a carrier, a redistribution structure, and multiple packaging function modules, where the multiple packaging function modules each have at least a part wrapped by a colloid, and are fastened to the redistribution structure side by side; the redistribution structure is fastened to the carrier, and the redistribution structure includes one or more redistribution metal layers; the redistribution metal layer communicatively connects the multiple packaging function modules and the carrier. The redistribution structure further includes one or more interconnect metal layers, and the interconnect metal layer is communicatively connected to at least two packaging function modules so as to provide a signal path between the at least two packaging function modules. In the chip, two packaging function modules are placed on the carrier side by side, and a signal path is established between the two packaging function modules by using the redistribution structure.

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Patent Owner(s)

Patent OwnerAddress
HUAWEI TECHNOLOGIES CO LTD518129 \U3001 BANTIAN HUAWEI HEADQUARTERS OFFICE BUILDING LONGGANG DISTRICT GUANGDONG SHENZHEN SHENZHEN CITY GUANGDONG PROVINCE 518129

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fu, HuiLi Shenzhen, CN 22 109
Lin, Jyh Rong Zhubei, TW 8 62
Ma, Zhiqiang Zhubei, TW 42 245
Zhang, Xiaodong Shanghai, CN 191 2500

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