Integrated fan-out package and method of fabricating the same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
May 29, 2018
Issued Date -
N/A
app pub date -
Jul 21, 2016
filing date -
Jul 21, 2016
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Provided is an integrated fan-out package including a die, a first redistribution circuit structure, a second redistribution circuit structure, a plurality of solder joints, a plurality of conductive posts, and an insulating encapsulation. The first redistribution circuit structure and the second redistribution circuit structure are formed respectively over a back surface and an active surface of the die to sandwich the die. The solder joints are formed aside the die and connected to the first redistribution circuit structure. The conductive posts are formed on the solder joints and connected to the second redistribution circuit structure, and connected to the first redistribution circuit structure through the solder joints. A plurality of sidewalls of the die, a plurality of sidewalls of the conductive posts, and a plurality of sidewalls of the solder joints are encapsulated by the insulating encapsulation. A fabricating process of the integrated fan-out package is also provided.
First Claim
Other Claims data not available
Family
International Classification(s)
- 2016 Application Filing Year
- H01L Class
- 27971 Applications Filed
- 23507 Patents Issued To-Date
- 84.05 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 6 Citation Count
- H01L Class
- 23.71 % this patent is cited more than
- 7 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Nov 29, 2025 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Nov 29, 2029 |
