Fluid-filled microchannels

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United States of America Patent

PATENT NO 9953897
SERIAL NO

15216969

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Abstract

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A device comprises a first layer of a die. The first layer comprises a microchannel. The microchannel is partially filled with a liquid and partially filled with air. The die also comprises a second layer. The second layer of the die seals a top of the microchannel of the first layer.

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Patent Owner(s)

Patent OwnerAddress
HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP1701 E MOSSY OAKS ROAD SPRING TX 77389

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Escobar-Vargas, Sergio Palo Alto, US 11 124
Kumari, Niru Palo Alto, US 12 118

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