Circuit package having a plurality of epoxy mold compounds with different compositions

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10319657
APP PUB NO 20180025960A1
SERIAL NO

15546846

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Abstract

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A circuit package panel containing a packaging of epoxy mold compounds and a circuit device in the packaging, wherein the packaging comprises, at least one hybrid layer of a first epoxy mold compound and a second epoxy mold compound of a different composition.

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Patent Owner(s)

Patent OwnerAddress
HEWLETT-PACKARD DEVELOPMENT COMPANY L P10300 ENERGY DRIVE SPRING TX 77389

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Chien-Hua Corvallis, US 409 3027
Cumbie, Michael W Albany, US 272 997

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