Importance

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Abstract

A base-attached encapsulant for semiconductor encapsulation is used for collectively encapsulating a device-mounted surface of the semiconductor device-mounted substrate having semiconductor devices mounted thereon or a device-formed surface of a semiconductor device-formed wafer having semiconductor devices formed thereon. The base-attached encapsulant has a base and an encapsulating resin layer containing an uncured or semi-cured thermosetting resin component formed onto one of the surfaces of the base, and a linear expansion coefficient α¹ of the semiconductor device to be encapsulated by the base-attached encapsulant, a linear expansion coefficient α² of a cured product of the encapsulating resin layer, and a linear expansion coefficient α³ of the base satisfy both of the following formula (1) and (2);

description='In-line Formulae' end='lead'α¹<α³<α²  (1)description='In-line Formulae' end='tail'

description='In-line Formulae' end='lead'−2<α¹+α²−2α³<2  (2)description='In-line Formulae' end='tail'

wherein the unit of the linear expansion coefficient is ppm/K. The base-attached encapsulant for semiconductor encapsulation which suppress package warpage even if a package with a large area is encapsulated.

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First Claim