Method of manufacturing integrated circuit device
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United States of America Patent
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Oct 30, 2018
Grant Date -
Jan 25, 2018
app pub date -
Mar 16, 2017
filing date -
Jul 21, 2016
priority date (Note) -
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status (Latency Note)
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Abstract
A method of manufacturing an integrated circuit device includes providing a substrate with a pattern structure, the pattern structure including a plurality of first patterns that extend in a first direction, are parallel to one another, and are separated from one another with a space therebetween. At least one support structure that contacts an upper surface of the pattern structure and extends on the pattern structure in a second direction that crosses the first direction is formed. A buried layer that fills the spaces between the plurality of first patterns while the at least one support structure contacts the upper surface of the pattern structure is formed. The at least one support structure is separated from the pattern structure.
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