Laminated top plate of a workpiece carrier in micromechanical and semiconductor processing

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United States of America Patent

PATENT NO 10636690
APP PUB NO 20180025932A1
SERIAL NO

15356905

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Abstract

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A laminated top plate of a workpiece carrier is described that is particularly suitable for mechanical and semiconductor processing. In one example, A method of fabricating a workpiece carrier top plate includes dispensing conductive paste onto at least one of a plurality of ceramic sheets, embedding the paste between the plurality of ceramic sheets, compacting ceramic sheets together with the paste, and sintering the paste.

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Patent Owner(s)

Patent OwnerAddress
APPLIED MATERIALS INC3050 BOWERS AVENUE SANTA CLARA CA 95054

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Narendrnath, Kadthala R San Jose, US 31 2043

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