PROCESSED WAFER AS TOP PLATE OF A WORKPIECE CARRIER IN SEMICONDUCTOR AND MECHANICAL PROCESSING

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United States of America Patent

APP PUB NO 20180025931A1
SERIAL NO

15217328

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Abstract

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A processed wafer is described that may be used as a workpiece carrier in semiconductor and mechanical processing. In some examples, the workpiece carrier includes a substrate, an electrode formed on the substrate to carry an electric charge to grip a workpiece, a through hole through the substrate and connected to the electrode, and a dielectric layer over the substrate to isolate the electrode from the workpiece.

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Patent Owner(s)

Patent OwnerAddress
APPLIED MATERIALS INC3050 BOWERS AVENUE SANTA CLARA CA 95054

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Buchberger,, JR Douglas A Livermore, US 96 2969
Hua, Zhong Qiang Saratoga, US 38 2363
Nemani, Srinivas D Sunnyvale, US 260 12845
Pisharody, Gautam Newark, US 11 16
Roy, Shambhu N Fremont, US 17 984
Yieh, Ellie Y San Jose, US 130 4926

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