Systems and methods for sensing process parameters during semiconductor device fabrication
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United States of America Patent
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Jan 22, 2019
Grant Date -
Jan 25, 2018
app pub date -
Jul 25, 2016
filing date -
Jul 25, 2016
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Abstract
Semiconductor device fabrication systems and methods are provided. In an example, a semiconductor device fabrication system includes a semiconductor fabrication tool. Further, the semiconductor device fabrication system includes wireless sensors associated with the semiconductor fabrication tool. The wireless sensors measure process parameters of the fabrication tool and transmit wireless signals. The semiconductor device fabrication system also includes a sensor controller configured to identify the wireless sensors associated with the semiconductor fabrication tool and to receive the wireless signals from the wireless sensors. The semiconductor device fabrication system further includes a tool controller including a receiver for receiving data from the sensor controller. The tool controller is configured to sequentially assign system variable identifiers (SVID) to the data from the sensor controller, and to contextualize the data in data packets.
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