Plasma uniformity control by gas diffuser hole design
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United States of America Patent
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Jun 4, 2019
Grant Date -
Jan 25, 2018
app pub date -
Sep 28, 2017
filing date -
May 12, 2004
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Abstract
Embodiments of a method of depositing a thin film on a substrate is provided that includes placing a substrate on a substrate support that is mounted in a processing region of a processing chamber, flowing a process fluid through a plurality of gas passages in a diffuser plate toward the substrate supported on the substrate support, wherein the diffuser plate has an upstream side and a downstream side and the downstream side has a substantially concave curvature, and each of the gas passages are formed between the upstream side and the downstream side, and creating a plasma between the downstream side of the diffuser plate and the substrate support.
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