Ring bus architecture for use in a memory module

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United States of America Patent

PATENT NO 10346325
APP PUB NO 20180024950A1
SERIAL NO

15716046

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Abstract

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Ring bus architectures for use in a memory module are disclosed. A memory module may include a primary ring bus; a ring bus controller positioned on the primary ring bus; a secondary ring bus in communication with the primary ring bus via a first bus bridge; and a tertiary ring bus in communication with the secondary ring bus via a second bus bridge. The ring bus controller is configured to direct the first bus bridge to route data between the primary ring bus and the secondary ring bus and is configured to direct the second bus bridge to route data between the secondary ring bus and the tertiary ring bus.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRONICS CO LTDSUWON-SI GYEONGGI-DO 16677

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Sinclair, Alan Welsh Falkirk, GB 58 5225

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