Tetracarboxylic acid diester compound, polyimide precursor polymer and method for producing the same, negative photosensitive resin composition, patterning process, and method for forming cured film

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United States of America Patent

PATENT NO 10216085
APP PUB NO 20180024434A1
SERIAL NO

15616237

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Abstract

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The present invention provides a tetracarboxylic acid diester compound shown by the following general formula (1),

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SHIN-ETSU CHEMICAL CO LTDTOKYO TOKYO METROPOLIS

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hasegawa, Koji Jyoetsu, JP 299 3234
Iio, Masashi Jyoetsu, JP 41 172
Sagehashi, Masayoshi Jyoetsu, JP 84 530
Takemura, Katsuya Jyoetsu, JP 94 929
Urano, Hiroyuki Jyoetsu, JP 34 169

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