Sensor module and method for producing a sensor module
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United States of America Patent
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Apr 28, 2020
Grant Date -
Jan 25, 2018
app pub date -
Jun 24, 2015
filing date -
Jun 26, 2014
priority date (Note) -
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Abstract
A sensor module contains a sensor unit, a sensor cover, and a main body. The sensor unit has a sensor surface and a base surface. The sensor cover covers the sensor surface and at least a section of the base surface. The sensor cover is connected to the base surface and/or the main body by a fused connection. The main body is connected at least to the base surface of the sensor unit by a fused connection with a selectable relative position in relation to the sensor cover. Pre-mounting of the sensor unit in a sensor cover and advantageous encapsulation of a sensor can thus be achieved.
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