Thermal conductive silicone composition
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United States of America Patent
Stats
-
Jan 8, 2019
Grant Date -
Jan 25, 2018
app pub date -
Feb 8, 2016
filing date -
Mar 2, 2015
priority date (Note) -
In Force
status (Latency Note)
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Abstract
Provided is a thermal conductive silicone composition exhibiting no peeling of a heat dissipation grease and capable of maintaining a low thermal resistance, even under a severe condition. The thermal conductive silicone composition contains:
- (A) an organopolysiloxane having at least two alkenyl groups in one molecule and exhibiting a kinetic viscosity of 10 to 100,000 mm2/s at 25° C.;(B) a one-terminal-trifunctional hydrolyzable methylpolysiloxane;(C) an aluminum powder;(D) a zinc oxide powder;(E) an organohydrogenpolysiloxane;(F) an organohydrogenpolysiloxane other than the component (E); and(G) a platinum-based catalyst for hydrosilylation, wherein when a liquid obtained by mixing and dispersing the composition in toluene which is twice the amount of the composition has been sieved, a residue of not more than 5 ppm will be observed if using a 250 mesh sieve, and a residue of not less than 200 ppm will be observed if using a 440 mesh sieve.
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International Classification(s)
- 2016 Application Filing Year
- C09K Class
- 3076 Applications Filed
- 2094 Patents Issued To-Date
- 68.08 % Issued To-Date
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Patent Citation Ranking
- 0 Citation Count
- C09K Class
- 0 % this patent is cited more than
- 6 Age
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|---|---|---|---|---|
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