Thermal conductive silicone composition
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 8, 2019
Grant Date -
Jan 25, 2018
app pub date -
Feb 8, 2016
filing date -
Mar 2, 2015
priority date (Note) -
In Force
status (Latency Note)
Importance
Loading Importance Indicators... 
Abstract
Provided is a thermal conductive silicone composition exhibiting no peeling of a heat dissipation grease and capable of maintaining a low thermal resistance, even under a severe condition. The thermal conductive silicone composition contains:
- (A) an organopolysiloxane having at least two alkenyl groups in one molecule and exhibiting a kinetic viscosity of 10 to 100,000 mm2/s at 25° C.;(B) a one-terminal-trifunctional hydrolyzable methylpolysiloxane;(C) an aluminum powder;(D) a zinc oxide powder;(E) an organohydrogenpolysiloxane;(F) an organohydrogenpolysiloxane other than the component (E); and(G) a platinum-based catalyst for hydrosilylation, wherein when a liquid obtained by mixing and dispersing the composition in toluene which is twice the amount of the composition has been sieved, a residue of not more than 5 ppm will be observed if using a 250 mesh sieve, and a residue of not less than 200 ppm will be observed if using a 440 mesh sieve.
Loading the Abstract Image...
OK
First Claim
Family
Loading Family data...
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully