ANISOTROPIC CONDUCTIVE FILM AND CONNECTION STRUCTURE
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United States of America Patent
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N/A
Issued Date -
N/A
app pub date -
Mar 18, 2016
filing date -
Mar 20, 2015
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
Provided is an anisotropic conductive film that allows conductive particles to be sufficiently captured even by connecting terminals disposed at a fine pitch and can suppress a short circuit, and in particular, that can suppress variation of conduction resistance of a connection portion even when partial contact is caused by a thermal pressing tool during anisotropic conductive connection. In an anisotropic conductive film 1A, an insulating adhesive layer 3 contains conductive particles 2. The conductive particles 2 have an aspect ratio of 1.2 or more and are dispersed without being in contact with each other as viewed in a plan view, and an angle formed between a film surface S of the anisotropic conductive film 1A and a major axis direction of each of the conductive particles 2 is less than 40°. The anisotropic conductive film 1A preferably contains columnar conductive glass particles as the conductive particles 2.
First Claim
Other Claims data not available