MEMS devices having tethering structures
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United States of America Patent
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Nov 20, 2018
Grant Date -
Jan 25, 2018
app pub date -
Jul 21, 2016
filing date -
Jul 21, 2016
priority date (Note) -
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Abstract
The present disclosure relates to a method for fabricating a micro-electromechanical system (MEMS) device. In the method, a carrier wafer is received. A MEMS wafer, which includes a plurality of die, is bonded to the carrier wafer. A cavity is formed to separate an upper surface of the carrier wafer from a lower surface of a die of the MEMS wafer. A separation trench is formed to laterally surround the die, wherein formation of the cavity and the separation trench leaves a tethering structure suspending the die over the upper surface of the carrier wafer. The die and carrier wafer are translated with respect to one another to break the tethering structure and separate the die from the carrier wafer.
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