METHOD FOR PRODUCING A SEMICONDUCTOR MODULE
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United States of America Patent
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Jul 17, 2017
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Jul 20, 2016
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Abstract
The method comprises fabricating a semiconductor panel comprising a plurality of semiconductor devices, fabricating a cap panel comprising a plurality of caps, bonding the cap panel onto the semiconductor panel so that each one of the caps covers one or more of the semiconductor devices, and singulating the bonded panels into a plurality of semiconductor modules.
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