METHOD AND DEVICE FOR DETACHING A SUBSTRATE FROM A SUBSTRATE STACK

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United States of America Patent

SERIAL NO

15540282

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Abstract

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A method and device for detaching a carrier substrate from a substrate stack, which is formed by the carrier substrate and a product substrate, as well as a bonding layer bonding the carrier substrate and the product substrate. The bonding layer has an adhesive strength for bonding the carrier substrate and the product substrate, and the adhesive strength is at least partially reduced by a beam of electromagnetic radiation directed at least predominantly on the bonding layer.

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Patent Owner(s)

Patent OwnerAddress
EV GROUP E THALLNER GMBHDI ERICH THALLNER STRASSE 1 ST FLORIAN AM INN A-4782

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
BURGGRAF, Jurgen Scharding, AT 25 35

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