LEAD-FREE SOLDER COMPOSITION
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United States of America Patent
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May 22, 2017
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Jul 25, 2016
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Abstract
A lead-free solder composition includes tin, titanium and zinc. Based on 100 parts by weight of the total weight of tin, titanium and zinc, tin is present in an amount ranging from 20 to 40 parts by weight, and titanium is present in an amount ranging from 0.01 to 0.15 parts by weight.
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