Thermal management systems for electronics
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United States of America Patent
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Oct 9, 2018
Grant Date -
Jan 18, 2018
app pub date -
Jul 18, 2016
filing date -
Jul 18, 2016
priority date (Note) -
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Abstract
A refrigeration system for electronics includes a compressor disposed on a main line and configured to compress a refrigerant in the refrigeration system and a condenser disposed downstream of the compressor on the main line. An evaporator line is in fluid communication with the main line downstream of the condenser and has an evaporator configured to receive heat into the refrigerant from an external heat source. The system also includes an immersion line in fluid communication with main line downstream of the condenser. The immersion line includes an immersion cooling container that is configured to at least partially house electronics such that the electronics are in direct fluid communication with the refrigerant to cool the electronics.
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