Electronic component and manufacturing method thereof
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United States of America Patent
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Sep 4, 2018
Grant Date -
Jan 18, 2018
app pub date -
Jul 10, 2017
filing date -
Jul 14, 2016
priority date (Note) -
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status (Latency Note)
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Abstract
An electronic component includes a substrate including a first principal surface, a second principal surface positioned on a side opposite to the first principal surface, a first side surface that connects the first principal surface and the second principal surface and that extends along a first direction, a second side surface that connects the first principal surface and the second principal surface and that extends along a second direction intersecting the first direction, and a corner portion that connects the first side surface and the second side surface and that has a curved surface curved outwardly, and a chip arranged at the first principal surface of the substrate.
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